Electrical Engineering > EXAM > EE 569 IPC Test Questions | Verified with 100% Correct Answers (All)
EE 569 IPC Test Questions | Verified with 100% Correct Answers The two functions of a solder connection are Mechanical and electrical connection An imperfect solder joint may result in Electrical f ... ailure Keeping your workstation clean means you can Avoid contamination of the assembly ESD damage can be controlled by Proper grounding The primary reason not to eat or drink at your workstation is to avoid Ingesting lead A pointed soldering iron tip should be used For small connections When a solder joint is heated for more than 3 seconds There may be heat damage to the base material and plated barrel The main advantages of 63/37 eutectic solder are It melts at lower temperature and solidifies faster It's important to remove certain types of fluxes after hand soldering because Sticky residues can hold electrically conductive contaminants and cause metal corrosion Solder wetting is defined as A smooth, unbroken film of solder, feathered onto base metals The reason it is important to use the correct solder wire diameter is For control of speed and amount of solder The reason for tinning the soldering iron tip is to Transfer heat rapidly When the soldering iron contacts the cleaning sponge for too long The tip may cool down too much and may affect the formation of a proper solder joint Using excessive pressure when soldering can cause All of the above We solder on the termination side of the board - away from the components To prevent heat damage to the components Preheating Speeds up the soldering process to help prevent heat damage to the assembly It's important to remove the flux residue right after the soldering operation because It can harden and become difficult to remove If you think components may be sensitive to cleaning fluids, you should Ask about your company specific policy if you have any questions An ideal solder joint has A concave fillet, complete solder coverage, smooth texture, wetting that feathers smoothly onto metals, and the outline of the lead visible Class 3 requirements in the J-Standard 001 are for High reliability electronics - where failure is not an option A cold solder joint Looks dull and grainy, and is poorly wetted A solder bridge is An unwanted solder connection between two or more conductive features A disturbed solder joint is caused by Movements of the solder joint after the soldering iron is removed, but before the solder is cool enough to harden It is important to control static electricity at your workstation in order to Avoid damage to components We use solder flux to All of the above You should tin the tip of your soldering iron Both "A and "C" When you expect your soldering iron to sit (or idle) for a while, it is important to Tin the tip with solder to prevent oxidation Melting a little solder on the tip - before moving the solder wire to the other side - results in The formation of a heat bridge to transfer heat faster Re-melting a solder joint without using flux usually results in The texture of the solder becomes grainy, and weakening the strength of the connection The maximum preferred solder contact angle is 90 degrees or less What is an IPC standard? An evolving set of rules that the electronics industry follows to develop safe, reliable and quality products Select all statements that reflect the work of IPC today: IPC is the leading association that serves the global electronics industry IPC enhances member companies' knowledge and skills through training and certification programs IPC provides innovation and advocates for solutions to industry challenges IPC creates and revises standards for global electronics production Select the 2 standards used on the design floor IPC-2581: Helps designers' computers speak the same language IPC-2221: Establishes design principles on PCBs Select the 2 standards used on the PCB fabrication floor IPC-6012: Sets up a quality construction process IPC-4562A: Regulates the PCB base materials at the start of board production Select the 2 standards used on the assembly and soldering floor IPC-A-610: Provides assembly and soldering requirements IPC-7093: Regulates alignment of pads for more accurate placement of the electronic components Select the 2 standards used on the cleaning and coating floor IPC-CC-830: Establishes conformal coating materials requirements IPC-CH-65: Provides guidelines for cleaning and handling of the completed assembly An inspector on the soldering and assembly floor wants to ensure that the components of the printed board are aligned and soldered to the highest quality. Which IPC Standard should she use to complete this inspection? IPC-A-610 Acceptability of Electronic Assemblies: inspection of assembled boards The value of a resistor is measured in Ohms Tolerance is a measurement of How close a component must perform to its actual value The color band for tolerance is All of the above The band that tells your how many zeros to add to the value is called the Multiplier band Kilo-ohm, or K, is an abbreviation for how many ohms? 1,000 Meg-ohm, or M, is an abbreviation for how many ohms? 1,000,000 65,000 ohms can also be expressed as 65K ohms 4,350,000 ohms can also be expressed as 4.35M ohms The bill of Materials (BOM) calls for a 3.4 ohm +- 1% resistor. What are the color bands (left to right)? Orange, yellow, gold, brown Axial capacitors with color bands are always measured in Picofarads Capacitors with color bands always have 4 bands The BOM calls for a 62,000 pF +- 5% capacitor. What are the colors? Blue, red, orange, green Convert 450,000 pF to nF 450 nF Axial inductors with color bands are always measured in Microhenries [Show More]
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